Photo by SCANLAB GmbH
Posalux SA推出了一台用于电子制造的新设计的机器，该机器采用了Scanlab GmbH高度集成的Precsys 5轴扫描子系统。瑞士制造商的激光处理系统专门针对微加工的需求量身定制，也可用于处理诸如聚合物和陶瓷等具有挑战性的材料。该机器具有Precys，可实现超专有的高度动态梁挠度，以将激光点引导到工件上。通过用于制造电子测试设备的结果设置了微钻头精度的新标准标准，现在可以使用小于5 µm的孔角半径。
For years, continuous miniaturization in the electronics and semiconductor industry has naturally forced even the device connectors to become ever tinier. This means probe cards for testing electronics must themselves be made smaller, too. A key component of probe cards are their guide plates. They contain a mechanically stable substrate with thousands of micro-bore-holes through which the probe card’s contact pins must be safely and precisely guided to facilitate subsequent reliable contact with the semiconductor device’s connectors. Substrates are made of ceramics. And it is exactly this material that is so challenging to process.
Greatest Flexibility Combined with Intuitive Operation
Posalux的激光处理机专门解决了这些要求。Scanlab的集成子系统与超短脉冲（USP）激光相结合，可以处理高度多样的材料，例如金属，聚合物和陶瓷，而无需热影响它们。扫描溶液为机器的X，Y，Z坐标轴和同时叠加，可调的入射角（正或负）提供了五个轴，用于机器X，Y，Z坐标轴的定义激光束引导。这使得它是制造具有高纵横比和自由定义几何形状的微孔孔的理想选择。直观的用户界面使计算机操作员可以轻松地加载钻孔图像，分配过程参数并扫描工件表面。
业内人士都知道的当务之急to create ever-smaller bore geometries. This makes it all the more impressive that Posalux’s precSYS infrared machine already fulfills application specifications previously thought only possible at green wavelengths. Here, customers’ usage demonstrates that even bore holes specified for 30 µm x 30 µm edge lengths, 300 µm material thickness and 10 µm separation are consistently achievable. In that application case, 46,000 bore holes were examined for positioning accuracy of ±2 µm, and corner radii smaller than 5 µm were reliably achieved. Thus, the user has available a robustly designed machine for processing any desired geometries in the µm range, as well as their exact localization to ±2 µm, across a maximum working area of 300 mm x 300 mm.
“我们很高兴我们的微加工子系统在应用程序中表现出色。而且，我们不仅收到了来自Posalux的积极反馈，而且还来自其他行业的其他集成商和用户。在这些出色的结果之后，我们越来越期待着“绿色变体”的precys结果。评论Scanlab的首席执行官Georg Hofner在这些事态发展方面。
目前，PRECSYS子系统专为具有1030 nm波长的红外激光器生产。为具有515 nm波长的绿色激光器开发了一种新变体，从而使甚至更精细的结构和转角半径。预计在2019年夏季预计最初的原型。
有关更多信息，请访问https://scanlab.de。
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