Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions. We are present in virtually all markets and industries from medical to mining, food processing to vehicle manufacturing, aerospace avionics to remote sensing, and security systems to space exploration.
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With expertise spanning the Medical, Industrial and Defence sectors, Teledyne e2v pioneers industry-leading innovation and technology around the world. We provide standard and custom RF and Semiconductor solutions that meet our customers' exacting performance needs and specification requirements. Our unique approach to the market and our genuine understanding of the application challenges that can occur – from initial concept right through to manufacture – enable us to help our customers optimise their system’s performance, reliability and cost of ownership.
Teledyne e2v provides high quality CMOS and CCD image sensors and sub-systems which deliver high performance across a range of applications in automation, healthcare, scientific and safety markets. Teledyne e2v also develops custom solutions with our customers, as their innovation partner. Our CMOS image sensors meet the need for high sensitivity, low noise and high speed. Specialist applications include data collection, intra-oral x-ray, ophthalmology, machine vision, industrial, space, surveillance, microscopy and spectroscopy.
Our advanced systems and instruments technology group comprises scientists, engineers and designers that collaborate to invent and develop new sensor products, technologies and systems solutions.
Our heritage and capabilities spans a broad set of markets and applications from space all the way to the ground.
Teledyne e2v leads and partners academic and industrial groups in the industrialisation of quantum technologies for a myriad of applications covering land, sea, air and space in the fields of atomic timing, cold atom sensors and quantum imaging.
With a growing UK based team of 30 plus dedicated scientists and engineers developing the next generation of quantum timing and sensing systems, we are one of the largest commercial capabilities available to commercialise academic research and move demonstration to real life application.
Teledyne e2v has been enabling scientific discoveries for over 30 years through its imaging and Scientific high power radio frequency solutions covering a plethora of disciplines from high energy physics to life sciences through to astronomy.
Our backside illuminated (BSI) and backthinned Charge Coupled Devices (CCDs) and front and back illuminated CMOS image sensors (CIS) are seen as the gold standard for scientific and quantum imaging in applications in spectroscopy, microscopy, in vivo, x-ray and astronomy. We understand that every imaging application is unique and requires our engineers and scientists to work closely with our customers providing highly tailored imaging solutions.
Utilizing our 30+ years' of experience in upgrading and redesigning commercial grade processors, we've developed products and services to optimize cost of system ownership dramatically.
The QorIQ® PowerPC processor portfolio offers the highest performance for small form factor/power-efficient applications.
With Teledyne e2v’s expertise in environmental and performance boosting techniques, these processors can be used in a breadth of hi-rel applications, use the table below to explore our offerin
The QorIQ® PowerPC processor portfolio offers the highest performance for small form factor/power-efficient applications.
With Teledyne e2v’s expertise in environmental and performance boosting techniques, these processors can be used in a breadth of hi-rel applications, use the table below to explore our offering.
The QorIQ® communications processor portfolio offers unmatched depth and breadth, with the addition of NXP’s next-generation QorIQ Layerscape series processors built on Arm® core technology, the portfolio extends performance to the smallest form factor.
With Teledyne e2v’s expertise in environmental and performance boosting techniques, these processors can be used in a breadth of hi-rel applications, use the table below to explore our offering.
The PowerQUICC® II and III family are based on the scalable 603e and e500 system-on-chip (SoC) platforms and Power ArchitectureTM processor cores.
With Teledyne e2v’s expertise in environmental and performance boosting techniques, these processors can be used in a breadth of hi-rel applications, use the table below to explore our offering.
Your electronic systems need the best IC technology to enable high-performance, high-reliability, broadband RF solutions for your receivers, transmitters and exciters. Teledyne e2v brings you state-of-the-art broadband data converters in advanced bipolar, CMOS and BiCMOS processes. Converting analog signals directly from RF to digital with our ADCs and directly from digital to RF with our DACs allows you to design simpler, more reliable high-performance systems and benefit from programmability and flexibility of those systems.
Teledyne e2v has been innovating data converter technologies for over 20 years and offers a range of Giga Samples per second (GSps) analog-to-digital converters that feature:
The cutting-edge technology packed into Teledyne e2v’s data converters allow our customers to significantly simplify designs with licence free, standard and customized solutions.
Teledyne e2v has been innovating data converter technologies for over 20 years and offers some of the most powerful Giga Samples per second (GSps) digital to analog converters on the market that feature:
The cutting-edge technology packed into Teledyne e2v’s data converters allow our customers to significantly simplify designs with licence free, standard and customized solutions.
Teledyne e2v offers technical support for integrating our data converters into FPGA-based systems. To support our data converters, we provide license free design examples for major FPGA vendors.
Latest Teledyne e2v data converters, such as EV12AQ60x and EV12DD700, are supported by ESIstream, a license free data transmission protocol.
The protocol is proposed and maintained by Teledyne e2v, but it is not proprietary. Everyone is free to adopt it to take advantage of its 87.5% data rate efficiency.
The ESIstream protocol is born from a strong need of the following combination:
Teledyne e2v Semiconductors designs and delivers space qualified high-speed broadband data converters operating at microwave frequencies for since 1995.
With a strong heritage and its expertise built up over the years, we provide a range of radiation tolerant ADCs and DACs capable to operate in harshest environment to support the most challenging applications and missions.
Teledyne e2v is qualified to the most stringent aerospace standards, such as QML-Q, QML-V and QML-Y. We also actively contribute to draft new aerospace standards.
And for new space systems, some highly different quality levels are available to achieve the best trade-offs between performance and cost optimization.
As a global provider of advanced embedded semiconductors for harsh environments, Teledyne e2v Semiconductors has developed a memory offering to address the high-reliability market.
• The 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications
• Teledyne e2v’s MRAMs is the ideal memory solution for applications that must permanently store and retrieve critical data quickly. It perfectly suits the requirements of critical embedded applications such as avionics, aerospace and defence environments.
Teledyne e2v的mram类型EV2A16A extended-reliability version of the MR2A16A from Everspin. It is the ideal memory solution for applications that must permanently store and retrieve critical data quickly. It perfectly suits the requirements of critical embedded applications such as avionic, aerospace and defence environments.
Applications
The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
Space Key Features
Space Qualification
• Up to NASA Level 1 (based on NASA EEE-INST-002 – Section M4 – PEMs)
• Up to ECSS Class 1 (ECSS-Q-ST-60-13C)
Obsolescence planning is a critical component of every program. Teledyne e2v’s Semiconductor Lifecycle Management program (SLiM™) provides long-term, proactive assurance of continuity of supply for critical components. SLiM supports platform life extension helping our customers avoid the need for expensive redesign and requalification when an original component becomes obsolete during the lifetime of the system, and offers the potential for improved integrity, counterfeit avoidance, lower costs, and reduced risk over the lifetime of the assets.
This new standard in semiconductor obsolescence management provides:For U.S.-sourced products, visit Teledyne e2v HiRel using these buttons
With 35 years experience in die banking, repackaging and testing of available product, and re-engineering of hi-rel designs, Teledyne e2v can help manage obsolescence of key semiconductor components at the start of or through the life of a program.
Systems used in high-performance, safety-critical or mission-critical applications need to incorporate superior microelectronics technology. Often the hardware required is not readily available off the shelf, as particular characteristics or constraints exist that mean a bespoke solution will be necessary. That can add considerable complexity to development projects, so partnering with a recognized specialist in this area is advised.
By engaging with Teledyne e2v Semiconductors, you are benefitting from decades’ worth of microelectronics experience - gaining access to a unique to the market one-stop-shop which is capable of developing the technology needed for even the most demanding situations.
Thanks to exceptional in-house expertise and use of highly-optimized workflows, our team can deal with every element of the development process. They are able to take initial concepts then move them through the early design phases. From there, prototyping, characterization, screening and testing can all be done, before moving onto volume production.
Covering telecommunications, industrial, space, avionics, military and medical applications, the solutions that Teledyne e2v Semiconductors offers are developed to exactly match each customer’s specific technical and commercial expectations. They can achieve heightened performance levels and cope with the most uncompromising of operational conditions (including exposure to extreme temperatures, shocks, vibrations and radiation).
Every project embarked upon by Teledyne e2v Semiconductors will have its own distinct attributes and bring up a new set of challenges, but through many years of serving the high-rel industry sectors, first class results are always assured.
With packaging, assembly, testing, screening and standards qualification all included.
通过一个处理一切源头e, rather than having to work with multiple partners, Teledyne e2v Semiconductors customers can avoid all the difficulties that will arise from having to manage suppliers for each different step of the process and the coordination of their respective activities.
System-in-Package (SiP) is a common route to take in modern high-density microelectronics projects where exceptional degrees of operational reliability and elevated performance levels are going to be mandated. The principal reasons for opting for a SiP solution are simple to grasp. They are namely to make systems as small as possible and keep the power budgets involved down, while also accelerating the associated turnaround times and simultaneously dealing with far lower unit volumes than a system-on-chip (SoC) approach would be able to support.
The mission-critical systems utilized in avionics, military and space applications need microelectronic devices that are capable of attaining exceptional reliability, so that the risk of potential malfunctions can be mitigated. Having a trusted source of such devices is therefore a fundamental requirement.
